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datasheet product structure silicon monolithic integrated circuit this product has not designed protection against ra dioactive rays 1/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 tsz22111 ? 14 ? 001 www.rohm.com 1 channel compact high side switch ics current limit high side switch ics bd226xg-m series general description bd226xg-m series are low on-resistance n-channel mosfet high-side power switches, optimized for universal serial bus (usb) applications. bd226xg-m series are equipped with the function of over-curre nt detection, thermal shutdown, under-voltage lockout and soft-start. features aec-q100 qualified over current protection 0.3a: bd2262g-m 0.76a: bd2264g-m / bd2265g-m 0.97a: bd2266g-m / BD2267G-M built-in low on-resistance (typ 120m ? ) n-channel mosfet reverse current protection when power switch off thermal shutdown under-voltage lockout open-drain error flag output output discharge function soft start circuit control input logic active-high: bd2262g-m /bd2264g-m /bd2266g-m active-low: bd2265g-m /BD2267G-M applications key specifications input voltage range: 2.7v to 5.5v on-resistance: 120m ? (typ) over-current threshold: 0.3a, 0.76a, 0.97a standby current: 0.01 a (typ) operating temperature range: -40c to +85c package w(typ) d(typ) h(max) car accessory, industrial applications typical application circuit lineup over-current threshold min typ max control input logic package orderable part number 0.2a 0.3a 0.4a high ssop5 reel of 3000 bd2262g-mgtr 0.63a 0.76a 0.9a high ssop5 reel of 3000 bd2264g-mgtr 0.63a 0.76a 0.9a low ssop5 reel of 3000 bd2265g-mgtr 0.82a 0.97a 1.12a high ssop5 reel of 3000 bd2266g-mgtr 0.82a 0.97a 1.12a low ssop5 reel of 3000 BD2267G-Mgtr ssop5 2.90mm x 2.80mm x 1.25mm 10k ? to 100k ? c l c in in gnd en out /oc 5v (typ) + - 3.3v downloaded from: http:///
d a t a s h e e t bd226xg-m series 2/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 block diagram pin configurations pin description pin no. symbol i/o function 1 in - switch input and the supply voltage for the i c. 2 gnd - ground. 3 en, /en i enable input. en: high level input turns on the switch.(bd2262g-m, bd2264g-m, bd2266g-m) /en: low level input turns on the switch. (bd2265g-m, BD2267G-M ) 4 /oc o over-current detection terminal. low level output during over-current or over-tempera ture condition. open-drain fault flag output. 5 out o switch output. in out top view in gnd en,/en out /oc 1 2 3 4 5 downloaded from: http:///
a t a s h e e t bd226xg-m series 3/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (ta=25c) parameter symbol rating unit in supply voltage v in -0.3 to +6.0 v en(/en) input voltage v en , v /en -0.3 to +6.0 v /oc voltage v /oc -0.3 to +6.0 v /oc sink current i /oc 5 ma out voltage v out -0.3 to +6.0 v storage temperature tstg -55 to +150 c power dissipation pd 0.67 (note 1) w (note 1) mounted on 70mm x 70mm x 1.6mm glass epoxy b oard. reduce 5.4mw per 1c above 25c caution: operating the ic over the absolute maximum ratings ma y damage the ic. the damage can either be a short cir cuit between pins or an open circuit between pins and the internal circuitry. therefore, i t is important to consider circuit protection measures, su ch as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions rating parameter symbol min typ max unit in operating voltage v in 2.7 5.0 5.5 v operating temperature topr -40 - +85 c electrical characteristics (v in = 5v, ta= 25c, unless otherwise specified.) dc characteristics limit parameter symbol min typ max unit conditions - 135 175 v en = 5v (bd2262g-m) v out = open operating current i dd - 110 160 a v en = 5v (bd2264/ 66g-m) v /en = 0v (bd2265/ 67g-m) v out = open standby current i stb - 0.01 5 a v en = 0v (bd2262/ 64/ 66g-m) v /en = 5v (bd2265/ 67g-m) v out = open v enh(/enh) 2.0 - - v high input, v in =3.3 to 5v v enl(/enl) - - 0.8 v low input, v in =5v en input voltage v enl(/enl) - - 0.6 v low input, v in =3.3v en input leakage i en(/en) -1 +0.01 +1 a v en(/en) = 0v or 5v - 120 165 v in =5v i out = 100ma (bd2262g-m) i out = 500ma (bd2264/ 65/ 66/ 67g-m) on-resistance r on - 140 190 m ? v in =3.3v i out = 100ma (bd2262g-m) i out = 500ma (bd2264/ 65/ 66/ 67g-m) reverse leak current i rev - - 1.0 a v out = 5.0v, v in = 0v 200 300 400 v in = 5v 190 290 390 v in = 3.3v bd2262g-m 630 765 900 v in = 5v 600 740 890 v in = 3.3v bd2264/ 65g-m 820 970 1120 v in = 5v over-current threshold i th 730 940 1110 ma v in = 3.3v bd2266/ 67g-m 100 200 300 bd2262g-m 350 500 650 bd2264/ 65g-m short circuit output current i sc 500 650 850 ma v in =3.3 to 5v v out = 0v, rms bd2266/ 67g-m output discharge resistance r disc 30 60 120 ? i disc = 1ma /oc output low voltage v /oc - - 0.4 v i /oc = 0.5ma v tuvh 2.1 2.3 2.5 v v in increasing uvlo threshold v tuvl 2.0 2.2 2.4 v v in decreasing downloaded from: http:///
a t a s h e e t bd226xg-m series 4/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 t on1 t off1 90% 10% 10% t on2 t off2 v enh v enl 90% v en v out t on1 t off1 90% 10% 10% t on2 t off2 v /enl v /enh 90% v /en v out ac characteristics limit parameter symbol min typ max unit conditions output rise time t on1 - 1 6 ms output turn on time t on2 - 1.5 10 ms output fall time t off1 - 1 20 s output turn off time t off2 - 3 40 s bd2262g-m: r l = 500 ? bd2264/ 65/ 66/ 67g-m: r l = 20 ? /oc delay time t /oc 10 15 20 ms measurement circuit in gnd en(/en) out /oc v in v en(/en) a 1f in gnd en(/en) out /oc v in v en(/en) a 1f r l a. operating current b. en, /en input voltage, output r ise / fall time in gnd en(/en) out /oc v in v en(/en) a 1f i out 10k ? in gnd en(/en) out /oc v in v en(/en) a 1f i oc c. on-resistance, over-current detection d. /oc out put low voltage figure 1. measurem ent circuit timing diagram figure 3. output rise / fall time (bd2265g-m, BD2267G-M) figure 2. output rise / fall time (bd2262g-m, bd2264g-m, bd2266g-m) downloaded from: http:///
a t a s h e e t bd226xg-m series 5/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves (bd226xg-m) figure 4. standby current vs supply voltage (en, /en disable) 0 .0 0 .2 0 .4 0 .6 0 .8 1.0 2 3 4 5 6 ta=25c supply voltage : v in [v] standby current : i stb [ a] figure 5. standby current vs ambient temperature (en, /en disable) 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 v in =5.0v ambient temperature : ta[c] standby current : i stb [ a] figure 7. en, /en input voltage vs ambient temperature (v enh , v enl , v /enh , v /enl ) 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 v in =5.0v low to high high to low ambient temperature : ta[c] enable input voltage : v en, v /en [v] figure 6. en, /en input voltage vs supply voltage (v enh , v enl , v /enh , v /enl ) 0.0 0.5 1.0 1.5 2.0 2 3 4 5 6 ta=25c low to high high to low supply voltage : v in [v] enable input voltage : v en , v /en [v] downloaded from: http:///
a t a s h e e t bd226xg-m series 6/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued (bd226xg-m) figure 8. on-resistance vs supply voltage 0 50 100 150 200 2 3 4 5 6 ta=25c supply voltage : v in [v] on-resistance : r on [m ? ] figure 9. on-resistance vs ambient temperature 0 50 100 150 200 -50 0 50 100 v in =5.0v ambient temperature : ta[c] on-resistance : r on [m ? ] figure 10. /oc output low voltage vs supply voltage 0 20 40 60 80 100 2 3 4 5 6 ta=25c supply voltage : v in [v] /oc output low voltage: v /oc [mv] figure 11. /oc output low voltage vs ambient temperature ambient temperature : ta[c] /oc output low voltage: v /oc [mv] 0 20 40 60 80 100 -50 0 50 100 v in =5.0v downloaded from: http:///
a t a s h e e t bd226xg-m series 7/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 typical performance curves - continued (bd226xg-m) figure 12. uvlo threshold voltage vs ambient temperature 2.0 2.1 2.2 2.3 2.4 2.5 -50 0 50 100 v tuvh v tuvl uvlo threshold: v tuvh, v tuvl [v] ambient temperature: ta [c] figure 13. uvlo hysteresis voltage vs ambient temperature uvlo hysteresis voltage: v hys [v] ambient temperature: ta [c] figure 14. /oc delay time vs supply voltage 10 12 14 16 18 20 2 3 4 5 6 supply voltage : v in [v] /oc ddlay time : t /oc [ms] ta=25c /oc delay time : t /oc [ms] /oc delay time: t /oc [ms] supply voltage: v in [v] figure 15. /oc delay time vs ambient temperature 10 12 14 16 18 20 -50 0 50 100 ambient temperature : ta[ ] /oc ddlay time : t /oc [ms] v in =5.0v /oc delay time : t /oc [ms] /oc delay time: t /oc [ms] ambient temperature: ta [c] downloaded from: http:///
a t a s h e e t bd226xg-m series 8/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued (bd226xg-m) figure 16. output discharge resistance vs supply voltage 0 50 100 150 200 2 3 4 5 6 ta=25c supply voltage: v in [v] output discharge resistance: r disc [ ? ] figure 17. output discharge resistance vs ambient temperature 0 50 100 150 200 -50 0 50 100 v in =5.0v ambient temperature: ta [c] output disharge resistance: r disc [ ? ] downloaded from: http:///
a t a s h e e t bd226xg-m series 9/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued (bd2262g-m) figure 18. operating current vs supply voltage en enable 0 20 40 60 80 100 120 140 160 2 3 4 5 6 supply voltage : v in [v] operating current : i dd [ a] ta=25c figure 19. operating current vs ambient temperature en enable 0 20 40 60 80 100 120 140 160 -50 0 50 100 ambient temperature : ta [c] operating current : i dd [ a] v in =5.0v figure 20. over-current threshold vs supply voltage 0.0 0.1 0.2 0.3 0.4 0.5 0.6 2 3 4 5 6 supply voltage : v in [v] over current threshold : i th [a] ta=25c 0.0 0.1 0.2 0.3 0.4 0.5 0.6 -50 0 50 100 ambient temperature : ta [c] over current threshold : i th [a] figure 21. over-current threshold vs ambient temperature v in =5.0v downloaded from: http:///
a t a s h e e t bd226xg-m series 10/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued (bd2262g-m) figure 24. output turn-on time vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] turn on time : t on2 [ms] ta=25c figure 22. output rise time vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] rise time : t on1 [ms] ta=25c 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta [c] turn on time : t on2 [ms] figure 25. output turn-on time vs ambient temperature v in =5.0v 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta [c] rise time : t on1 [ms] figure 23. output rise time vs ambient temperature v in =5.0v downloaded from: http:///
a t a s h e e t bd226xg-m series 11/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued (bd2262g-m) figure 28. output turn-off time vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 6.0 2 3 4 5 6 supply voltage : v in [v] turn-off time : t off2 [ s] ta=25c 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] fall time : t off1 [s] figure 26. output fall time vs supply voltage ta=25c 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -50 0 50 100 ambient temperature : ta [c] turn-off time : t off2 [ s] figure 29. output turn-off time vs ambient temperature v in =5.0v 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta [c] fall time : t off1 [s] figure 27. output fall time vs ambient temperature v in =5.0v downloaded from: http:///
a t a s h e e t bd226xg-m series 12/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued (bd2264g-m, bd2265g-m) 0.4 0.5 0.6 0.7 0.8 0.9 1.0 2 3 4 5 6 ta=25c figure 32. over-current threshold vs supply voltage supply voltage: v in [v] over current threshold: i th [a] 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -50 0 50 100 v in =5.0v figure 33. over-current threshold vs ambient temperature over current threshold: i th [a] ambient temperature: ta [c] 0 20 40 60 80 100 120 140 2 3 4 5 6 ta=25c figure 30. operating current vs supply voltage (en, /en enable) operating current : i dd [ a] supply voltage : v in [v] ambient temperature: ta [c] operating current : i dd [ a] 0 20 40 60 80 100 120 140 -50 0 50 100 v in =5.0v figure 31. operating current vs ambient temperature (en, /en enable) downloaded from: http:///

a t a s h e e t bd226xg-m series 13/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued (bd2264g-m, bd2265g-m) 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 ta=25c figure 36. output turn-on time vs supply voltage turn o n time : t on 2 [ms] supply voltage: v in [v] 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 v in =5.0v figure 37. output turn-on time vs ambient temperature tur n o n time : t on 2 [ms] ambient temperature: ta [c] 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 v in =5.0v figure 35. output rise time vs ambient temperature rise time : t on1 [ms] ambient temperature: ta [c] figure 34. output rise time vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 ta=25c rise time : t on1 [ms] supply voltage: v in [v] downloaded from: http:///
a t a s h e e t bd226xg-m series 14/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued (bd2264g-m, bd2265g-m) 0.0 1.0 2.0 3.0 4.0 5.0 6.0 2 3 4 5 6 ta=25c figure 40. output turn-off time vs supply voltage turn o ff time : t o ff2 [ s] supply voltage: v in [v] 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -50 0 50 100 v in =5.0v figure 41. output turn-off time vs ambient temperature turn o ff time : t o ff2 [ s] ambient temperature: ta [c] 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 ta=25c figure 38. output fall time vs supply voltage fall time : t o ff1 [ s] supply voltage: v in [v] 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 v in =5.0v figure 39. output fall time vs ambient temperature fall time : t o ff1 [ s] ambient temperature: ta [c] downloaded from: http:///
a t a s h e e t bd226xg-m series 15/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued (bd2266g-m, BD2267G-M) 0.7 0.8 0.9 1.0 1.1 1.2 1.3 2 3 4 5 6 ta=25c figure 44. over-current threshold vs supply voltage over current threshold: i th [a] supply voltage: v in [v] 0.7 0.8 0.9 1.0 1.1 1.2 1.3 -50 0 50 100 v in =5.0v figure 45. over-current threshold vs ambient temperature over current threshold: i th [a] ambient temperature: ta [c] 0 20 40 60 80 100 120 140 2 3 4 5 6 ta=25c figure 42. operating current vs supply voltage (en, /en enable) operating current : i dd [ a] supply voltage : v in [v] ambient temperature: ta [c] operating current : i dd [ a] 0 20 40 60 80 100 120 140 -50 0 50 100 v in =5.0v figure 43. operating current vs ambient temperature (en, /en enable) downloaded from: http:///
a t a s h e e t bd226xg-m series 16/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued (bd2266g-m, BD2267G-M) 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 ta=25c figure 48. output turn-on time vs supply voltage turn o n time : t on 2 [ms] supply voltage: v in [v] 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 v in =5.0v figure 49. output turn-on time vs ambient temperature turn o n time : t on 2 [ms] ambient temperature: ta [c] figure 46. output rise time vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 ta=25c rise time : t on1 [ms] supply voltage: v in [v] 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 v in =5.0v figure 47. output rise time vs ambient temperature rise time : t on1 [ms] ambient temperature: ta [c] downloaded from: http:///
a t a s h e e t bd226xg-m series 17/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued (bd2266g-m, BD2267G-M) turn o ff time : t o ff2 [ s] supply voltage: v in [v] 0.0 1.0 2.0 3.0 4.0 5.0 6.0 2 3 4 5 6 ta=25c figure 52. output turn-off time vs supply voltage turn o ff time : t o ff2 [ s] ambient temperature: ta [c] 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -50 0 50 100 v in =5.0v figure 53. output turn-off time vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 ta=25c figure 50. output fall time vs supply voltage fall time : t o ff1 [ s] supply voltage: v in [v] 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 v in =5.0v figure 51. output fall time vs ambient temperature fall time : t o ff1 [ s] ambient temperature: ta [c] downloaded from: http:///
a t a s h e e t bd226xg-m series 18/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical wave forms (bd2262g-m) time (5ms/div.) figure 57. over-current response ramped load v /oc (5v/div.) v out (5v/div.) i out (0.2a/div.) vin=5v time (1ms/div.) figure 56. inrush current response (5v/div.) v en i out (100ma/div.) cl=22uf cl=47uf cl=100uf vin=5v rl=50 v /oc (5v/div.) time (1us/div.) figure 55. output fall characteristic v en (5v/div.) vin=5v rl=500 v /oc (5v/div.) v out (5v/div.) i out (10ma/div.) time (1ms/div.) figure 54. output rise characteristic v en (5v/div.) v /oc (5v/div.) v out (5v/div.) vin=5v rl=500 i out (10ma/div.) downloaded from: http:///
a t a s h e e t bd226xg-m series 19/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical wave forms C continued (bd2262g-m) time (5ms/div.) figure 60. over-current response 1 load to enabled device v /oc (5v/div.) v out (5v/div.) i out (1a/div.) vin=5v time (5ms/div.) figure 58. over-current response enable to shortcircuit v en (5v/div.) v /oc (5v/div.) v out (5v/div.) vin=5v i out (0.2a/div.) time (500ms/div.) figure 59. over-current response enable to shortcircuit v en (5v/div.) v /oc (5v/div.) v out (5v/div.) vin=5v i out (0.2a/div.) time (5ms/div.) figure 61. uvlo response increasing v in v in (5v/div.) v out (5v/div.) rl=500 i out (10ma/div.) downloaded from: http:///
a t a s h e e t bd226xg-m series 20/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical wave forms C continued (bd2262g-m) time (10ms/div.) figure 62. uvlo response decreasing v in v in (5v/div.) v out (5v/div.) i out (10ma/div.) rl=500 downloaded from: http:///
a t a s h e e t bd226xg-m series 21/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical wave forms C continued (bd2264g-m) v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v in =5v time (5ms/div.) figure 66. over-current response ramped load time (1ms/div.) figure 65. inrush current response (5v/div.) v en i out (0.2a/div.) v /oc (5v/div.) c l =47 f c l =100 f c l =220 f v in =5v r l =20 ? time(1 s/div.) figure 64. output fall characteristic v en (5v/div.) v in =5v v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) r l =20 ? time(1ms/div.) figure 63. output rise characteristic r l =20 ? v en (5v/div.) v /oc (5v/div.) v out (5v/div.) v in =5v i out (0.5a/div.) downloaded from: http:///
a t a s h e e t bd226xg-m series 22/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical wave forms C continued (bd2264g-m) time (5ms/div.) figure 69. over-current response 1 ? load connected at en v /oc (5v/div.) v out (5v/div.) i out (1a/div.) v in =5v time (10ms/div.) figure 70. uvlo response when increasing v in v in (5v/div.) v out (5v/div.) i out (0.2a/div.) r l =20 ? time (100ms/div.) figure 68. over-current response enable to short circuit v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v in =5v time (5ms/div.) figure 67. over-current response enable to short circuit v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v in =5v v in =5v downloaded from: http:///
a t a s h e e t bd226xg-m series 23/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical wave forms C continued (bd2264g-m) time (10ms/div.) figure 71. uvlo response when decreasing v in v in (5v/div.) v out (5v/div.) i out (0.2a/div.) r l =20 ? downloaded from: http:///
a t a s h e e t bd226xg-m series 24/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical wave forms C continued (bd2266g-m) v en (5v/div.) v in =5v v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) time(1ms/div.) figure 72. output rise characteristic v en (5v/div.) v in =5v v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) time(1us/div.) figure 73 . output fall characteristic time (1ms/div.) figure 74 . inrush current response time (5ms/div.) figure 75. over-current response ramped load (5v/div.) v en iout (0.2a/div.) v /oc (5v/div.) c l =47uf c l =100uf c l =220uf v in =5v r l =20 v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v in =5v r l =20 r l =20 downloaded from: http:///
a t a s h e e t bd226xg-m series 25/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical wave forms C continued (bd2266g-m) time (5ms/div.) figure 76. over-current response enable to shortcircuit time (100ms/div.) figure 77. over-current response enable to shortcircuit time (5ms/div.) figure 78. over-current response 1 load to enabled device time (10ms/div.) figure 79. uvlo response increasing vin v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v in =5v v /oc (5v/div.) v out (5v/div.) i out (1a/div.) v in =5v v in (5v/div.) v out (5v/div.) i out (0.2a/div.) r l =20 v en (5v/div.) v /oc (5v/div.) v out (5v/div.) v in =5v i out (0.5a/div.) downloaded from: http:///
a t a s h e e t bd226xg-m series 26/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical wave forms C continued (bd2266g-m) time (10ms/div.) figure 80. uvlo response decreasing v in v in (5v/div.) v out (5v/div.) i out (0.2a/div.) r l =20 downloaded from: http:///
a t a s h e e t bd226xg-m series 27/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical application circuit controller 10k ? to 100k ? c l c in in gnd en(/en) out /oc 5v (typ) + - application information when excessive current flows due to output short-ci rcuit or so, ringing occurs by inductance of power source line and ic. this may cause bad effects on ic operations. in ord er to avoid this case, a bypass capacitor (c in ) should be connected across the in terminal and gnd terminal of ic. a 1 f or higher value is recommended. moreover, in orde r to decrease voltage fluctuations of power source line and ic, c onnect a low esr capacitor in parallel with c in. a 10 f to 100 f or higher is effective. pull up /oc output by resistance 10k ? to 100k ? . set up values for c l which satisfies the application. this application circuit does not guarantee its ope ration. when using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components including ac/dc characteristics as well as dispersion of the ic. functional description 1. switch operation in terminal and out terminal are connected to the d rain and the source of switch mosfet respectively. the in terminal is also used as power source input to internal cont rol circuit. when the switch is turned on from en(/en) control i nput, the in and out terminals are connected by a 1 20m ? (typ) switch. in on status, the switch is bidirectional. therefore, when the potential of out terminal is hi gher than that of in terminal, current flows from out to in terminal. on the other hand, when the switch is turned off, it is possible to prevent current from flowing reversely from out to in termi nal since a parasitic diode between the drain and t he source of switch mosfet is not present. 2. thermal shutdown circuit (tsd) if over-current would continue, the temperature of the ic would increase drastically. if the junction temperature goes beyond 135c (typ) in the condition of over-current detection, thermal shutdown circuit operates and t urns power switch off, causing the ic to output a fault flag (/oc). t hen, when the junction temperature decreases lower than 115c (typ), the power switch is turned on and fault flag (/oc) is cancelled. this operation repeats, unless the in crease of chip?s temperature is removed or the output of power switc h is turned off. the thermal shutdown circuit operates when the swit ch is on (en(/en) signal is active). 3. over-current detection (ocd) the over-current detection circuit limits current ( i sc ) and outputs fault flag (/oc) when current flowing in each switch mosfet exceeds a specified value. the over-current detection circuit works when the switch is on (en(/ en) signal is active). there are three types of response against over-current: (1) when the switch is turned on while the output i s in short circuit status, the switch goes into cur rent limit status immediately. (2) when the output short-circuits or high capacity load is connected while the switch is on, very lar ge current flows until the over-current limit circuit reacts. when the current detection and limit circuit operat es, current limitation is carried out. (3) when the output current increases gradually, cu rrent limitation would not operate unless the outpu t current exceeds the over-current detection value. when it e xceeds the detection value, current limitation is c arried out. downloaded from: http:///
a t a s h e e t bd226xg-m series 28/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 4. under-voltage lockout (uvlo) uvlo circuit prevents the switch from turning on un til the v in exceeds 2.3v(typ). if v in drops below 2.2v(typ) while the switch is still on, then uvlo shuts off the power s witch. uvlo has a hysteresis of 100mv(typ). under-voltage lockout circuit operates when the swi tch is on (en(/en) signal is active). 5. fault flag (/oc) output fault flag output is n-mos open drain output. durin g detection of over-current and/or thermal shutdown , the output level will turn low. over-current detection has delay filter. this delay filter prevents current detection flags from being sent during instantaneous events such as inrush current at swit ch on or during hot plug. if fault flag output is u nused, /oc pin should be connected to open or ground line. figure 81. over-current detection v en v out i out v /oc output s hort c ircuit thermal s hutdown /oc delay time figure 82. over-current detection, thermal shutdown timing (bd2262g-m, bd2264g-m, bd2266g-m) v /en v out i out v /oc output s hort c ircuit thermal s hutdown /oc delay time figure 83. over-current detection, thermal shutdown timing (bd2265g-m, BD2267G-M ) v out i out v /oc t /oc over current detection i sc over current load removed i th downloaded from: http:///
a t a s h e e t bd226xg-m series 29/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 power dissipation (ssop5 package) figure 84. power dissipation curve (pd-ta curve) i/o equivalence circuit symbol pin no. equivalence circuit en (/en) 3 en (/en) out 5 vout /oc 4 /oc 70mm x 70mm x 1.6mm glass epoxy board 85 out 0 100 200 300 400 500 600 700 0 25 50 75 100 125 150 ambient temperature : ta [ ] power dissipation : pd [mw] power dissipation : p d [mw] ambient temperature : ta[c] downloaded from: http:///
a t a s h e e t bd226xg-m series 30/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse po larity when connecting the power supply, such as mounting an ex ternal diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impeda nce supply lines. separate the ground and supply li nes of the digital and analog blocks to prevent noise in the g round and supply lines of the digital block from af fecting the analog block. furthermore, connect a capacitor to ground a t all power supply pins. consider the effect of tem perature and aging on the capacitance value when using electroly tic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient c ondition. 4. ground wiring pattern when using both small-signal and large-current grou nd traces, the two ground traces should be routed s eparately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that t he ground traces of external components do not caus e variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedanc e. 5. thermal consideration should by any chance the power dissipation rating b e exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the ab solute maximum rating of the pd stated in this spec ification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass ep oxy board. in case of exceeding this absolute maxim um rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approxim ately obtained. the electrical characteristics are guaran teed under the conditions of each parameter. 7. in rush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inr ush current may flow instantaneously due to the interna l powering sequence and delays, especially if the i c has more than one power supply. therefore, give spe cial consideration to power coupling capacitance, power wiring, width of ground wiring, and routing o f connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electr omagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connec ting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacito rs completely after each process or step. the ic?s power supply should always be turned off completely before conne cting or removing it from the test setup during the inspection process. to prevent damage from static discharge, g round the ic during assembly and use similar precau tions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid e nvironment) and unintentional solder bridge deposited in betwee n pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high i mpedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the tr ansistor and cause unexpected operation of the ic. so unless oth erwise specified, unused input pins should be conne cted to the power supply or ground line. downloaded from: http:///
a t a s h e e t bd226xg-m series 31/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes - continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p subs trate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersect ion of the p layers with the n layers of other elem ents, creating a parasitic diode or transistor. for example (refer t o figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a p arasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can re sult in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p subs trate) should be avoided. figure 85. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the diele ctric constant considering the change of capacitanc e with temperature and the decrease in nominal capacitance due to dc bias and others. 14. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit tha t prevents heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if how ever the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. whe n the tj falls below the tsd threshold, the circuits are automatically r estored to normal operation. note that the tsd circuit operates in a situation t hat exceeds the absolute maximum ratings and theref ore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 15. thermal design perform thermal design in which there are adequate margins by taking into account the power dissipatio n (pd) in actual states of use. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
a t a s h e e t bd226xg-m series 32/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 ordering information b d 2 2 6 x g - m g t r part number bd2262g bd2264g bd2265g bd2266g bd2267g package g: ssop5 product rank m: for automotive packaging and forming specification g: halogen free tr: embossed tape and reel marking diagram part number part number marking bd2262g-m z0 bd2264g-m z1 bd2265g-m z2 bd2266g-m z3 BD2267G-M z4 part number marking ssop5 (top view) lot number downloaded from: http:///
a t a s h e e t bd226xg-m series 33/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name ssop5 downloaded from: http:///
a t a s h e e t bd226xg-m series 34/34 tsz02201-0r5r0h300010-1- 2 ? 2014 rohm co., ltd. all rights reserved. 03.feb.2014 rev.001 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 03.feb.2014 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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